Canteliver Probe Card
MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding answer for the calls for of fine pitch, compact pad size, substantial pace, less cleaning, multi-DUT, higher pin rely, and ultra-lower leakage necessities. With outstanding craftsmanship, modern architecture and demonstrated methodologies dependant on mechanical and electrical simulation/measurement results, creating MPI the top cantilever provider globally.
FCB Probe Card
The FCB Probe Card is among the most mature technologies of buckling beam probe card. It's aimed to realize the semiconductor ship manufacture time-to-industry (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor output assessments from early engineering pilot-runs to large volume producing (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or ability integrity probing (PI). Apps incorporate cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB ensures the entire world’s very best In general Charge-of-ownership (COO) for many DUT apps.
EVS Probe Card
The EVS Probe Card is definitely an improvement above the conventional buckling beam probe card. Critical attributes are bigger recent carrying capacity (C.C.C.) and decreased balanced Get hold of force (BCF), and Total MEMS-like characteristics. EVS can easily fulfill the necessity of Highly developed wafer probing. Precise alignment and great planarity Manage are definitely the important components contributing to secure Make contact with resistance. With its ability and performance, EVS Probe Card is an excellent option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand for ever finer pitch. It truly is suitable for smaller sized Al pad, which is perfect for very small pitch application with peripheral and complete array pattern. With exact alignment and greater planarity Command, Osprey can attain larger productiveness by check here multi-DUT style and design. The forming wire (FW) type needle created with MPI’s very own micro fabrication approach not simply provides significant-quality performance but additionally permits effortless needle alternative and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle and that is created for the desire of lower power probing. Furthermore, it includes the chance to satisfy high C.C.C. and higher pin counts software. The MEMS system makes sure remarkably reliable needle features, along with the Particular construction design permits exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/